MediaTek releases 5G test prototype equipped with M70 baseband
2025-04-30117
At the recent "Integrated Circuit 60th Anniversary IC60 Exhibition" held in Taiwan, MediaTek unveiled its 5G testing prototype, which is equipped with MediaTek M70 baseband. The baseband is based on TSMC's 7-nanometer process and has made significant improvements in heat control.
It is reported that MediaTek has been investing in 5G research and development for 5 years, committed to turning complex 5G technology into fingertip sized chips. At this exhibition, the 5G prototype is showcased as a milestone achievement of its previous generation chips.
MediaTek's 5G prototype is not a single device, but a product system composed of multiple devices, as the development of 5G technology involves a series of technological breakthroughs from the transmitter to the terminal.
According to previously released information, Helio M70 supports 5G NR new air interface, complies with 3GPP Release 15 independent networking specifications, has a high download speed of up to 5Gbps, and will supply 5G chips for smartphones in 2019..
MediaTek did not provide a detailed introduction to the technical specifications of this prototype, only stating that it is a prototype used for development engineering testing, which facilitates engineers to experience the feasibility of 5G new technology, correct possible communication errors, and test whether the designed circuit can achieve the speed target value. Therefore, the two "skylights" specially left on the back shell of the phone are used to connect with the testing platform.
MediaTek also pointed out that due to the much faster transmission speed of 5G compared to 4G, a large amount of heat is generated during circuit operation. Therefore, multiple fans were used on the prototype to dissipate heat and cool down. However, the final 5G commercial equipment will have MediaTek's unique low-power design, which does not require fans.
MediaTek stated that in the past five years, it has invested thousands of people in 5G related research and development, participated in the formulation and decision-making of 5G standards, and has successively obtained multiple 5G core technology patents, keeping pace with other chip design giants.
At the MWC 2018 conference in February this year, MediaTek also signed a memorandum of cooperation with many partners such as Huawei, Nokia, China Mobile, and NTT Docomo on the "5G Terminal Pioneer Program" to promote the commercialization of 5G by 2020.
Xie Qingjiang, Vice Chairman of MediaTek, stated that in the future, 5G will not only increase mobile internet speeds by 10 times, but also have a breakthrough impact on various fields of technology such as cloud computing, connected vehicles, and intelligent networking.
It is reported that MediaTek has been investing in 5G research and development for 5 years, committed to turning complex 5G technology into fingertip sized chips. At this exhibition, the 5G prototype is showcased as a milestone achievement of its previous generation chips.
MediaTek's 5G prototype is not a single device, but a product system composed of multiple devices, as the development of 5G technology involves a series of technological breakthroughs from the transmitter to the terminal.
According to previously released information, Helio M70 supports 5G NR new air interface, complies with 3GPP Release 15 independent networking specifications, has a high download speed of up to 5Gbps, and will supply 5G chips for smartphones in 2019..
MediaTek did not provide a detailed introduction to the technical specifications of this prototype, only stating that it is a prototype used for development engineering testing, which facilitates engineers to experience the feasibility of 5G new technology, correct possible communication errors, and test whether the designed circuit can achieve the speed target value. Therefore, the two "skylights" specially left on the back shell of the phone are used to connect with the testing platform.
MediaTek also pointed out that due to the much faster transmission speed of 5G compared to 4G, a large amount of heat is generated during circuit operation. Therefore, multiple fans were used on the prototype to dissipate heat and cool down. However, the final 5G commercial equipment will have MediaTek's unique low-power design, which does not require fans.
MediaTek stated that in the past five years, it has invested thousands of people in 5G related research and development, participated in the formulation and decision-making of 5G standards, and has successively obtained multiple 5G core technology patents, keeping pace with other chip design giants.
At the MWC 2018 conference in February this year, MediaTek also signed a memorandum of cooperation with many partners such as Huawei, Nokia, China Mobile, and NTT Docomo on the "5G Terminal Pioneer Program" to promote the commercialization of 5G by 2020.
Xie Qingjiang, Vice Chairman of MediaTek, stated that in the future, 5G will not only increase mobile internet speeds by 10 times, but also have a breakthrough impact on various fields of technology such as cloud computing, connected vehicles, and intelligent networking.
粤ICP备00000000